Reducing the Load of the Haptic Brain Stimulator
Session Number
ENGN 06
Advisor(s)
Pedro Lopes, University of Chicago
Discipline
Engineering
Start Date
17-4-2024 10:45 AM
End Date
17-4-2024 11:00 AM
Abstract
We engineer a haptic device that renders touch and force-feedback across the user’s entire body by stimulating the brain. Our technique builds upon transcranial magnetic stimulation (TMS), a neuroscience technology that non-invasively stimulates the brain using an electromagnetic coil. Medical-grade TMS coils are typically large, handheld devices, which makes integrating them into an actuated system challenging. Our technical contribution is to provide a novel robotic platform that precisely actuates the coil towards the target brain areas while ensuring user comfort and wearability. We explore methods to alleviate the load on the user, utilizing a supporting backpack or a hanging counterweight. By employing a lighter TMS coil, reducing the degrees of freedom of the actuator, using primarily laser-cut acrylic and FDM printed parts, and separating the electronics from the headset with Bowden cables, we have constructed a lighter and more comfortable device.
Reducing the Load of the Haptic Brain Stimulator
We engineer a haptic device that renders touch and force-feedback across the user’s entire body by stimulating the brain. Our technique builds upon transcranial magnetic stimulation (TMS), a neuroscience technology that non-invasively stimulates the brain using an electromagnetic coil. Medical-grade TMS coils are typically large, handheld devices, which makes integrating them into an actuated system challenging. Our technical contribution is to provide a novel robotic platform that precisely actuates the coil towards the target brain areas while ensuring user comfort and wearability. We explore methods to alleviate the load on the user, utilizing a supporting backpack or a hanging counterweight. By employing a lighter TMS coil, reducing the degrees of freedom of the actuator, using primarily laser-cut acrylic and FDM printed parts, and separating the electronics from the headset with Bowden cables, we have constructed a lighter and more comfortable device.